Method for mounting electronic devices

Details Method for mounting electronic devices Method for mounting electronic devices

1994-06-20

1996-04-09

Heinrich, Samuel M.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228217, 228253, 148 25, H05K 330

Patent

active

055053661

ABSTRACT:
The present invention relates to a method for mounting electronic devices on a substrate by using soldering with flux which contains materials capable of ion-exchanging or ion-catching so as to catch impurity ions which seep from a solder portions, and thereby it is not necessary to have a fusing step and a cleaning step in an plating process of the method.

REFERENCES:
patent: 4428780 (1984-01-01), Shedroff
patent: 4495007 (1985-01-01), Zado
patent: 4919731 (1990-04-01), Iyogi et al.
patent: 5167729 (1992-12-01), Takemoto et al.

Affiliated with

Also associated with

Rating

Method for mounting electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting electronic devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-133736