Method for mounting electronic components on substrates

Details Method for mounting electronic components on substrates Method for mounting electronic components on substrates

2005-08-30

2005-08-30

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S233100

Reexamination Certificate

active

06935556

ABSTRACT:
In the method for mounting electronic components on substrates by means of pressure sintering, a paste which is composed of a metal powder and a solvent is applied between the component and the substrate. Once the paste has dried completely, the component is placed on the substrate. A number of such arrangements (4) together with a substrate and component are then compressed at the sintering temperature in an isostatic press (6). A large number of complex and/or fragile parts can be connected at the same time, and with very high precision.

REFERENCES:
patent: 3608809 (1971-09-01), Cushman
patent: 4243169 (1981-01-01), Sara
patent: 4856185 (1989-08-01), Baumgartner et al.
patent: 5352629 (1994-10-01), Paik et al.
patent: 5632434 (1997-05-01), Evans et al.
patent: 5893511 (1999-04-01), Schwarzbauer
patent: 6250907 (2001-06-01), Bergman
patent: 0330895 (1989-09-01), None
patent: 0460286 (1991-12-01), None
patent: 1309343 (1989-12-01), None

Affiliated with

Also associated with

Rating

Method for mounting electronic components on substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting electronic components on substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting electronic components on substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3475146