Method for mounting electronic components on a substrate

Details Method for mounting electronic components on a substrate Method for mounting electronic components on a substrate

2005-07-11

2009-11-24

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S832000, C257S774000

Reexamination Certificate

active

07621042

ABSTRACT:
A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic components which are inserted and positioned in the positioning holes protrudes from one surface of the film substrate, and the other surfaces thereof are positioned in the positioning holes, respectively. Conductive patterns are formed on the other surface of the film substrate and are electrically connected to the other surfaces of the electronic components positioned in the positioning holes.

REFERENCES:
patent: 4912844 (1990-04-01), Parker
patent: 5173844 (1992-12-01), Adachi et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 6333566 (2001-12-01), Nakamura
patent: 6974909 (2005-12-01), Tanaka et al.
patent: 9-139561 (1997-05-01), None

Affiliated with

Also associated with

Rating

Method for mounting electronic components on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting electronic components on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting electronic components on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4118957