Method for mounting electronic components

Details Method for mounting electronic components Method for mounting electronic components

2007-10-16

2007-10-16

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S836000, C029S739000, C029S740000, C029S759000, C029S832000, C029S833000, C382S151000

Reexamination Certificate

active

11153805

ABSTRACT:
A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.

REFERENCES:
patent: 4951388 (1990-08-01), Eguchi et al.
patent: 6006425 (1999-12-01), Fukukura et al.
patent: 6457232 (2002-10-01), Isogai et al.
patent: 6516514 (2003-02-01), Pruefer
patent: 2003-273582 (2003-09-01), None

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