Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1982-02-22
1983-09-20
Rutledge, L. Dewayne
Metal working
Method of mechanical manufacture
Assembling or joining
29589, 357 79, 357 81, H01L 2152, H01L 2158
Patent
active
044047398
ABSTRACT:
A semiconductor element is positioned between opposing faces of two thermally and electrically conductive members. An external force is then applied to the two members to move the opposing faces of the members toward each other and against the sides of the element. While this external force is maintained, the members are fixed in a housing by means of bonding means, and are separated from the housing by an electrically insulating, thermally conducting material, which may itself be the bonding means. Upon removal of the external force from the members, the members are held by the bonding means and the housing in thermal and electrical contact with the semiconductor element, and the assembly has been pre-stressed. During the operation of the semiconductor element the pressure is controlled by thermally responsive elements.
REFERENCES:
patent: 2907935 (1959-10-01), Nagorsen
patent: 3943623 (1976-03-01), Mizutani et al.
patent: 4209799 (1980-06-01), Schierz et al.
Kiley Richard F.
Larson, Jr. Ralph I.
Rutledge L. Dewayne
Schiavelli Alan E.
Thermal Associates, Inc.
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