Method for mounting electrically conductive wires to a substrate

Metal working – Method of mechanical manufacture – Assembling or joining

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Details

29622, 264249, B25K 2500, H01H 900

Patent

active

041931815

ABSTRACT:
A switch assembly comprises a deformable electrically insulative substrate with a plurality of grooves formed therein extending in a direction parallel to a given axis. Electrically conductive wires are disposed in the grooves and extend beyond one end of the substrate. The grooves have a width and a depth such that the wires are accurately positioned in the substrate and securely held therein. The wire is secured in the groove by a tool having a concaved end portion which stradles the wire and is moved toward the substrate until the cut out portion essentially contacts the top of the wire, and the substrate material flows onto the wire for locking the wire in the groove.

REFERENCES:
patent: 2572956 (1951-10-01), Servis
patent: 3314138 (1967-04-01), Double
patent: 4052590 (1977-10-01), Anderl
patent: 4095327 (1978-06-01), Hartmann

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