Method for mounting devices on a substrate

Details Method for mounting devices on a substrate Method for mounting devices on a substrate

1978-02-02

1980-12-02

Crane, Daniel C.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29840, 29711, 29704, 83 621, B23P 2100, B23P 2300

Patent

active

042363063

ABSTRACT:
The invention relates to a method and apparatus which is intended to equip a support substrate with integrated circuit devices of different kinds mounted originally on films. The apparatus includes a machine having cutting heads each associated with the film, and soldering heads. The substrate is mounted on a plate which is movable on a table in a direction perpendicular to the movement of the table, which movement takes place on a threaded spindle drive by a motor. The operation of the machine is monitored and controlled by a unit such as a computer. The invention is applicable in particular to mounting such devices on substrates intended for data-processing assemblies.

REFERENCES:
patent: 3412415 (1968-11-01), Vieser et al.
patent: 3508315 (1970-04-01), Hoffken
patent: 3597824 (1971-08-01), Yoshida et al.
patent: 3710479 (1973-01-01), Bernardo et al.
patent: 3742574 (1973-07-01), Bennett et al.
patent: 3744361 (1973-07-01), Van Doorn et al.
patent: 3765075 (1973-10-01), Olney, Jr. et al.
patent: 3777350 (1973-12-01), Maeda et al.
patent: 3887783 (1975-06-01), Comette
patent: 3893232 (1975-07-01), Fletcher et al.
patent: 4051593 (1977-10-01), Mori et al.

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