Method for mounting conjoined devices

Details Method for mounting conjoined devices Method for mounting conjoined devices

1982-12-02

1984-08-21

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

357 75, 357 80, H01L 2192, H01L 2114

Patent

active

044661819

ABSTRACT:
Method of manufacturing a semiconductive device which comprises: positioning plural semiconductive chips on a film so that one surfaces of the chips form a flat plane; connecting the semiconductive chips with insulative member to make one conjoined body; thereafter removing the film from the conjoined body; securing the conjoined body on a wiring board and forming metallic wires which connect the wiring board and the semiconductive chips in a manner that the wires be closely fit to the flat plane of the conjoined body.

REFERENCES:
patent: 3689804 (1972-09-01), Ishihama et al.

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