Metal fusion bonding – Process – Plural joints
Patent
1992-04-30
1992-11-17
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228189, 228212, 228118, A05K 334
Patent
active
051636050
ABSTRACT:
A component is mounted to a circuit board by covering a section of the board's conductive pads with a nonconductive mask. It is also possible to plate additional conductive material onto the pads before applying the mask. The component's contacts are soldered to the uncovered sections of the pads or plating.
REFERENCES:
patent: 5001829 (1991-03-01), Schelhorn
patent: 5012969 (1991-05-01), Hatada et al.
patent: 5060844 (1991-10-01), Behun et al.
Lambert, Jr. Richard P.
Matheis Helmut
Mencik Michael J.
Swenson Donald K.
Allied-Signal Inc.
Heinrich Samuel M.
Masssung Howard G.
Walsh Robert A.
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