Method for mounting component chips and apparatus therefor

Details Method for mounting component chips and apparatus therefor Method for mounting component chips and apparatus therefor

1993-05-28

1995-01-24

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29721, 29740, 29832, H05K 334, B23P 2100

Patent

active

053832701

ABSTRACT:
A method and apparatus for mounting components on a substrate that insures that if the component, because of its shape can only be mounted if picked up in a specific area will not attempt mounting unless the component is picked up in that specific area. Various methods for setting and determining desirable pick up locations are disclosed.

REFERENCES:
patent: Re33974 (1992-06-01), Asai et al.
patent: 4404741 (1983-09-01), Lebet
patent: 4476626 (1984-10-01), Gumbert et al.
patent: 4628464 (1986-12-01), McConnell
patent: 4738025 (1988-04-01), Arnold
patent: 4867569 (1989-09-01), Mohara
patent: 4980971 (1991-01-01), Bartsehat et al.
patent: 5079834 (1992-01-01), Itagaki et al.
patent: 5084959 (1992-02-01), Ando et al.
patent: 5084962 (1992-02-01), Takahashi et al.
patent: 5086559 (1992-02-01), Akatsuchi
patent: 5216804 (1993-06-01), Rosier et al..
patent: 5224262 (1993-07-01), Takaichi et al.

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