Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1999-03-30
2001-03-06
Young, Lee (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S739000, C029S740000, C029S743000, C029S840000
Reexamination Certificate
active
06195878
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method and device for mounting components whereby components such as electronic components, or the like, are mounted onto a substrate.
2. Description of the Related Art
As shown in
FIG. 7
, a conventional high-speed-type electronic component mounting device is generally constituted in such a manner that a component is extracted at a mounting section
1
from a desired component feeder
3
of a component supplying section
2
, and the component is mounted automatically onto a substrate
5
set on an XY table
4
. Numeral
6
denotes a transporting rail for transporting the substrate
5
to and from the device, and numeral
7
denotes a display section for displaying the operational state and any irregular states of the component mounting device.
As shown in
FIG. 8
, in the component supplying section
2
, a plurality of component feeders
3
, into which component reels
8
, wherein components are held on a tape and wound into a reel, are set, are mounted on a component feeder table
9
which is movable in leftward and rightward directions. The component feeder table
9
being constituted in such a manner that any desired component feeder
3
can be located in a component supply position
10
, which is determined at a certain point, by moving the component feeder table
9
along a guide rail
9
a
. In the mounting section
1
, a plurality of mounting heads
12
are provided on the outer circumference of a rotating table
11
, which rotates intermittently, a component in the component feeder
3
located at the aforementioned component supply position
10
is picked up and held by a suction nozzle provided on a mounting head
12
, whereupon the rotating table
11
rotates and the component held by suction is mounted to a substrate
5
located in position by the XY table
4
, at the point that the mounting head
12
comes to rest in the component mounting position.
A single suction nozzle or a plurality of suction nozzles are provided on each mounting head
12
. In case a plurality of suction nozzles are provided, then the device is constructed in such a manner that a suction nozzle dedicated to a type of component can be selected. In either case, the device is constituted in such a manner that the single suction nozzle or the selected suction nozzle locates in the component suction position or the component mounting position when a mounting head
12
comes to rest in the component suction position or component mounting position, the operations of component suction and component mounting being carried out by an upward and downward action of the mounting head
12
.
However, in recent years, even higher component mounting speed has been demanded, and in this case, whilst it is relatively simple to shorten the movement time of the mounting heads
12
by increasing the speed of rotation of the rotating table
11
in the mounting section
1
, the time that can be used for moving the component supply table
9
and the XY table
4
is more restricted than the movement time for the mounting heads, and therefore it is difficult to shorten this movement time any further. In other words, movement of the component supply table
9
can only be started after a component has been picked up by the suction nozzle and raised to a prescribed height, and the movement thereof must be completed before the next suction nozzle descends to a position which is a prescribed height above the component suction height. The time which can be used for movement of the XY table
4
is similarly restricted in the case of component mounting. It is extremely difficult to shorten this movement time further, because improvement in the movement speed of the component supply table
9
and the XY table
4
is already approaching its limit. Therefore, whilst it is necessary to shorten the distance of movement of the component supply table
9
and the XY table
4
in order to increase the speed of component mounting, this is not possible with a conventional device construction, and therefore presents a major impediment to achieving higher speeds for component mounting.
SUMMARY OF THE INVENTION
In view of the forgoing problems of the prior art, an object of the present invention is to provide a method and device for mounting components, whereby increases in mounting speed can be achieved by reducing the movement distance of the component feeder and the substrate.
The method for mounting components according to the present invention is a method for mounting components, whereby a component is picked up by a suction nozzle provided in a mounting head moving intermittently by rotation along a uniform path, when the mounting head comes to rest in a prescribed component supply position, and the component held by suction is mounted to a substrate when the mounting head comes to rest in a prescribed component mounting position, comprising: using a mounting head constructed such that a plurality of suction operating positions are set for the suction nozzle when the mounting head comes to rest in the component supply position, a first step of selecting a component supply position such that the amount of movement of component feeder holding a component to be mounted next becomes a minimum, and moving the component feeder accordingly; and a second step of selecting a suction nozzle position in accordance with the component supply position in the first step, whilst the mounting head is moving towards the component suction position, any of these suction operating positions being selectable; thereby enabling the amount of movement of the component feeder towards the component supply position to be reduced and the movement time to be shortened accordingly, and hence allowing increases in mounting speed to be achieved.
Moreover, by using a mounting head, wherein a plurality of mounting operating positions are set for the suction nozzle when the mounting head comes to rest in the component mounting position, any of these suction operating positions being selectable, and by comprising: a first step of selecting a component mounting position such that the amount of movement of the substrate towards the mounting position for the component to be mounted next becomes a minimum, and moving the substrate accordingly; and a second step of selecting a suction nozzle position in accordance with the component mounting position in the first step, whilst the mounting head holding the component by suction is moving towards the component mounting position; the amount of movement of the component feeder towards the component supply position can be reduced and the movement time can be shortened accordingly, thereby allowing increases in mounting speed to be achieved.
Furthermore, by using a mounting head wherein a plurality of suction or mounting operating positions are set for the suction nozzle when the mounting head comes to rest in the component supply position or the component mounting position, any of these suction or mounting operating positions being selectable, and by comprising: a first step of selecting a component supply position such that the amount of movement of component feeder holding a component to be mounted next becomes a minimum, and moving the component feeder accordingly; a second step of selecting a suction nozzle position in accordance with the component suction position in the first step, whilst the mounting head is moving towards the component suction position; a third step of selecting a component mounting position such that the amount of movement of the substrate towards the mounting position for the component to be mounted next becomes a minimum, and moving the substrate accordingly; and a fourth step of selecting a suction nozzle position in accordance with the component mounting position in the third step, whilst the mounting head holding the component by suction is moving towards the component mounting position; the amount of movement of the component feeder towards the component supply position can be reduced and the movement time can b
Hata Kanji
Negishi Shigetoshi
Oji Shiro
Seno Makito
Matsushita Electrical Industrial Co. Ltd.
Price and Gess
Trinh Minh
Young Lee
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