Method for mounting chip type circuit elements on a printed circ

Details Method for mounting chip type circuit elements on a printed circ Method for mounting chip type circuit elements on a printed circ

1977-04-12

1978-11-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29569R, 29740, 29757, 156562, 156565, 214 85R, 214 85A, 221 93, H01L 2198, B32B 3126, C09J 506

Patent

active

041274326

ABSTRACT:
Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board by pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer and which is inserted through a corresponding through-hole defined by a lattice-shaped and horizontally placed magazine guide. This method and apparatus can quickly mount chip type circuit elements on the printed circuit board, and make possible an easy change of the circuit element pattern, without necessitating the use of an NC machine.

REFERENCES:
patent: 1746988 (1930-02-01), Brautigam
patent: 1946878 (1934-02-01), Pazziani et al.
patent: 3600246 (1971-08-01), Breen
patent: 3658618 (1972-04-01), Gramann
patent: 3710479 (1973-01-01), Bernardo et al.
patent: 3890185 (1975-06-01), Umazume

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