Method for mounting chip component and circuit board

Details Method for mounting chip component and circuit board Method for mounting chip component and circuit board

2006-11-22

2010-06-15

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

With shaping

C228S180220, C228S207000, C228S223000

Reexamination Certificate

active

07735713

ABSTRACT:
A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.

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