Method for mounting an electronic module in a card body

Details Method for mounting an electronic module in a card body Method for mounting an electronic module in a card body

1996-01-24

1999-09-14

Maki, Steven D.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156282, 156311, 156312, B29C 6518

Patent

active

059518103

ABSTRACT:
A method is described for mounting an electronic module in an opening in a card body using pressure and heat. To avoid the thermal load on the electronic module and the card body during the relatively short heating-up phase in a fixed-cycle production process, the method is divided into several method steps, whereby either the heating of the electronic module and the card body and optionally a thermally-activable adhesive takes place in several method steps, or a thermally activable adhesive is heated selectively in a first method step and the mounting of the electronic module takes place under pressure or under pressure and heat in a second method step.

REFERENCES:
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patent: 3600248 (1971-08-01), Mojonnier et al.
patent: 3692608 (1972-09-01), Risgaard
patent: 3951713 (1976-04-01), Emmel
patent: 4450024 (1984-05-01), Haghiri-Tehrani et al.
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patent: 4897534 (1990-01-01), Haghiri-Tehrani
patent: 5057679 (1991-10-01), Audic et al.
patent: 5145548 (1992-09-01), Yamamoto
patent: 5346576 (1994-09-01), Kobayashi et al.
Shields, Adhesives Handbook, pp. 258-260, 1970.
Landrock, Adhesives Technology Handbook, pp. 211-213, 1985.
Abstract for Europe 493738.

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