Method for mounting an electronic component on a wiring substrat

Details Method for mounting an electronic component on a wiring substrat Method for mounting an electronic component on a wiring substrat

1996-05-31

1998-12-15

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29842, 156290, 361750, 361762, H05K 330, H01H 1100

Patent

active

058484620

ABSTRACT:
An insulating film 3 is provided with an opening 4 whose size is substantially equivalent to or slightly smaller than the outer configuration of electronic component 5. A conductive pattern 2 is formed on insulating substrate 1. After forcibly inserting the main body of electronic component 5 into said opening 4, terminals 6 are put between insulating film 3 and insulating substrate 1 and disposed in such a manner that terminals 6 are brought into contact with conductive pattern 2. Then, insulating film 3 is connected with insulating substrate 1 by fusing them in a region surrounding terminals 6, thereby firmly fixing terminals 6 of electronic component 5 on conductive pattern 2.

REFERENCES:
patent: 4320272 (1982-03-01), Larson
patent: 4365408 (1982-12-01), Dizig
patent: 4442938 (1984-04-01), Murphy
patent: 4449769 (1984-05-01), Kobayashi et al.
patent: 4772769 (1988-09-01), Shumate
patent: 4815981 (1989-03-01), Mizuno
patent: 4967261 (1990-10-01), Niki et al.
patent: 5331513 (1994-07-01), Hirai et al.
patent: 5361491 (1994-11-01), Oomachi et al.
patent: 5516988 (1996-05-01), Yamauchi
patent: 5569886 (1996-10-01), Tanabe et al.

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