Metal working – Method of mechanical manufacture – Electrical device making
Patent
1989-12-06
1991-08-27
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
174 524, 2281802, 361401, H05K 334
Patent
active
050421450
ABSTRACT:
A method for mounting a LSI chip (1) with conductive bumps (2, 3, 4) as terminals into a hole (15) of a card (5) and for interconnecting them. The card and therefore one end of the hole is first covered by a layer (16) of a conductive material. Then the conductive bumps of the chip placed in the hole are soldered to the layer while being pressed against this layer. Thus protrusions (17, 18, 19) are created on the external surface of the layer. These protrusions are ussed to facilitate the alignment of the mask used during the subsequent etching operation of the layer.
The invention also concerns a process for creating the conductive bumps (2, 3, 4) on the terminal pads (6, 7, 8) of the LSI chip (1).
REFERENCES:
patent: 3908075 (1975-09-01), Jackson et al.
patent: 4237607 (1980-12-01), Ohno
patent: 4746392 (1988-05-01), Hoppe
patent: 4774633 (1988-09-01), Dehaine et al.
patent: 4941257 (1990-07-01), Gloton
Mechanically Controlled Thermal Joining, IBM Tech. Discl. Bull. vol. 32, No. 84 Jan. 1990 p. 164.
M. Ohuchi et al., "A New LSI Interconnection Method for IC Card"; 2nd IEE International Electronics Manufacturing Technology Symposium pp. 30-33 (San Francisco 1986).
R. Nowicki, "Studies of the Ti-W/Au Metallization on Aluminum", International Conference on Metallurgical Coatings, San Francisco, Apr. 1978, pp. 195-205.
ALCATEL N.V.
Echols P. W.
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