Method for mounting an electronic component

Details Method for mounting an electronic component Method for mounting an electronic component

2005-06-14

2005-06-14

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

83, 83, 83, C073S865800

Reexamination Certificate

active

06904672

ABSTRACT:
This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

REFERENCES:
patent: 5134665 (1992-07-01), Jyoko
patent: 5555316 (1996-09-01), Tsujikawa et al.
patent: 6317972 (2001-11-01), Asai et al.
patent: 05-186940 (1995-01-01), None

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