Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Patent
1992-11-12
1994-03-01
Ramsey, Kenneth J.
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
26427217, 29841, H01L 2328
Patent
active
052901971
ABSTRACT:
A method for mounting a semiconductor chip on a first wire board, bonding a second wire board to a connecting terminal of the first wire board with a thermo-setting layer of anisotropic conductivity, covering the undersurface and periphery of the semiconductor chip by a first thermo-setting epoxy resin so as to embed and seal the semiconductor chip therein, and cover the connecting part of the first wire board and the second wire board by a second thermo-setting epoxy resin.
REFERENCES:
patent: 3693252 (1972-09-01), Robertson et al.
patent: 4643526 (1987-02-01), Watanabe et al.
IBM Technical Disclosure Bulletin, vol. 33, No. 7, Dec. 1990, New York, US, p. 213 "direct Chip Bonding for Liquid Crystal Display".
Derwent AN: 86-001771.
Ohnuma Yoshinao
Tagusa Yasunobu
Ramsey Kenneth J.
Sharp Kabushiki Kaisha
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