Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-01-04
1994-04-05
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
148DIG12, 156160, 156286, 156381, 437212, B32B 3120, H01L 21447
Patent
active
053001753
ABSTRACT:
A semiconductor wafer (40) is placed in a first pressure chamber (37) of a bonding apparatus (10 or 60). A major surface (46) of a submount (44) is placed on a submount support (30 or 62). The major surface (46) of the submount (44) seals the first pressure chamber (37). A pressure differential is generated between the first pressure chamber (37) and a second pressure chamber (47) The pressure differential bows a central portion of the submount (44) toward the semiconductor wafer (40). The central portion of the submount (44) contacts an adhesive coating over a central portion of the semiconductor wafer (40). The submount support (30 or 62) is displaced to decrease a curvature on the submount (44). The pressure differential is increased to an end-point to facilitate bond formation between the semiconductor wafer (40) and the submount (44).
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Gardner Lawrence R.
Griffith, Jr. Robert W.
Norman Michael P.
Ball Michael W.
Barbee Joe E.
Dover Rennie William
Motorola Inc.
Stemmer Daniel J.
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