Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-08-07
2011-10-11
Banks, Derris (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C438S412000, C438S455000, C257S507000
Reexamination Certificate
active
08033011
ABSTRACT:
A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate. The frame is used to support the double-side tape and can be designed to fit the conventional production line for holding, picking and transferring wafers. The carrier substrate can be a sapphire substrate, a quartz substrate or other substrates that can sustain further processing, such as thermal treatments and/or chemical etchings. The method of the present invention not only prevents possible damages to the highly brittle chip after wafer thinning, but also fits the conventional production line for processing semiconductor wafers.
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Chen Ping-Wei
Chou Jason
Hua Chang-Hwang
Yang Sen
Bacon & Thomas PLLC
Banks Derris
Kue Kaying
Win Semiconductors Corp.
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