Method for mounting a semiconductor package onto PCB

Details Method for mounting a semiconductor package onto PCB Method for mounting a semiconductor package onto PCB

2007-12-26

2010-06-01

Lam, Cathy (Department: 1794)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S774000, C257S786000, C174S250000, C174S261000

Reexamination Certificate

active

07728441

ABSTRACT:
A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals is connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the corresponding exposed centers of the contact pad to prevent the fine pitch contact pads from bridging.

REFERENCES:
patent: 3350498 (1967-10-01), Leeds
patent: 6025649 (2000-02-01), DiGiacomo
patent: 6878465 (2005-04-01), Moon et al.
patent: 483299 (2002-04-01), None

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