Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-06-13
2006-06-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S113000, C438S118000, C438S458000, C438S462000
Reexamination Certificate
active
07060528
ABSTRACT:
A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.
REFERENCES:
patent: 6075280 (2000-06-01), Yung et al.
patent: 6338980 (2002-01-01), Satoh
patent: 6376278 (2002-04-01), Egawa et al.
patent: 6420213 (2002-07-01), Nakajyo et al.
patent: 6561408 (2003-05-01), Hosotani et al.
patent: 6797544 (2004-09-01), Sakai et al.
patent: 01287936 (1989-11-01), None
patent: WO9830073 (1998-07-01), None
patent: 10256306 (1998-09-01), None
K. Nishida et al., “New Flip-Chip Bonding Technology NSD Method Using Resin Encapsulation Sheet”, Proceedings 2000, International Symposium on Microelectronics (International Microelectronics and Packaging Society) issued Sep. 20, 2000, (Matsushita Electric Ind. Co., Ltd.).
Nishida Kazuto
Nishikawa Hidenobu
Otani Hiroyuki
Shimizu Kazumichi
Chambliss Alonzo
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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