Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1996-09-09
1997-09-23
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257778, 257787, H01L 2331, H01L 2350
Patent
active
056708262
ABSTRACT:
A method for mounting a semiconductor device on a circuit board which includes the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than the plasticizing temperature of the thermoplastic conductive adhesive is disclosed.
REFERENCES:
patent: 4917466 (1990-04-01), Nakamura et al.
patent: 5121190 (1992-06-01), Hsiao et al.
Bessho Yoshihiro
Tomura Yoshihiro
Brown Peter Toby
Matsushita Electric - Industrial Co., Ltd.
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