Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-09-11
1994-03-22
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 98, 1562737, 1562739, 1562755, 1562757, B32B 300
Patent
active
052960633
ABSTRACT:
A method for mounting a semiconductor device wherein a semiconductor device on which connection electrodes are formed is connected to a circuit board on which electrodes are formed in positions corresponding to the connection electrodes of the semiconductor device, the method including steps of applying an adhesive on a connection face of the semiconductor device to the circuit board or that of the circuit board to the semiconductor device, aligning the electrodes in positions corresponding to each other with the semiconductor device opposed to the circuit board, partially curing the adhesive in portions other than the electrodes, electrically evaluating the connection of the semiconductor device to the circuit board, and curing the uncured adhesive.
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EP 91 30 2413 European Patent Office, European Search Report, Jun. 1991.
Nukii Takashi
Yamamura Keiji
Barry Chester T.
Conlin David G.
O'Connell Robert F.
Sharp Kabushiki Kaisha
Simmons David A.
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