Method for mounting a semiconductor chip onto a substrate

Details Method for mounting a semiconductor chip onto a substrate Method for mounting a semiconductor chip onto a substrate

2005-12-05

2008-08-05

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S233100, C228S233200

Reexamination Certificate

active

07407084

ABSTRACT:
A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps:(1) Lowering the semiconductor chip until the semiconductor chip touches the substrate,(2) Waiting a predetermined period of time during which a force exerted on the semiconductor chip disappears or is at least comparatively small, and(3) Applying a bond force.

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Search Report: Application No. 094142061; Wenping & Co.; Sep. 24, 2007, 1 pg.

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