Method for mounting a semiconductor chip

Details Method for mounting a semiconductor chip Method for mounting a semiconductor chip

1998-02-03

1999-11-30

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

059941650

ABSTRACT:
A method for mounting a semiconductor chip on a circuit board comprises the steps of pre-baking the circuit board to remove nonvolatile ingredients of epoxy resin, such as cyclohexane, in the circuit board at temperature above 170.degree. C. for above 10 minutes, and thermosetting the epoxy resin by applying a thrust force for thrusting the semiconductor chip against the circuit board at a maximum thrust force of 30 gf/bump.

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