Metal working – Method of mechanical manufacture – Electrical device making
Patent
1988-11-15
1990-09-11
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174260, 357 70, H05K 334
Patent
active
049551329
ABSTRACT:
A method for mounting a semiconductor chip on a circuit board is provided that comprises forming a wiring pattern, which is to be connected with electrodes of the semiconductor chip, on the circuit board; attaching an insulating film, which has at least one hole that fits the shape of the electrodes of the semiconductor chip, to the top of the wiring pattern and the exposed portion of the circuit board; filling the hole formed in the insulating film with a conductor; and placing the semiconductor chip on the insulating film, so that the electrodes of the semiconductor chip are connected electrically with the wiring pattern on the circuit board through the conductor.
REFERENCES:
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3868724 (1975-02-01), Perrino
patent: 4157932 (1979-06-01), Hirata
patent: 4336551 (1982-06-01), Fujita et al.
patent: 4617729 (1986-10-01), Celnik
patent: 4654752 (1987-03-01), Kyle
IBM Tech. Disclosure Bull., vol. 15, No. 2, Jul. 1972, p. 420, by O. Abolafia.
Arbes Carl J.
Sharp Kabushiki Kaisha
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