Method for mounting a semiconductor chip

Details Method for mounting a semiconductor chip Method for mounting a semiconductor chip

1984-09-07

1986-03-25

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Electrical device making

29831, 29589, 357 80, 357 81, H01L 2312

Patent

active

045773980

ABSTRACT:
A method of attaching a semiconductor chip to a mounting surface is disclosed. A solder barrier is applied to the mounting surface, and a preform of solder is located within the solder barrier. The preform is heated and then cooled in a vacuum to preflow the solder and secure the solder to the mounting surface substantially without voids. The semiconductor chip is then placed over the preflowed solder, which is reheated and then recooled in a vacuum to secure the chip to the mounting surface.

REFERENCES:
patent: 3399332 (1968-08-01), Savolainen
patent: 4139859 (1979-02-01), Lewis et al.
patent: 4203127 (1980-05-01), Tegge
patent: 4209347 (1980-06-01), Klein
patent: 4295151 (1981-10-01), Nyul et al.
patent: 4381602 (1983-05-01), McIver
patent: 4445271 (1984-05-01), Grabbe

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