Method for mounting a sapphire chip on a metal base and article

Stock material or miscellaneous articles – Composite – Of metal

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Details

228123, 428447, 428689, B32B 1504, B23K 3102

Patent

active

044579764

ABSTRACT:
A sapphire chip is bonded to a metal substrate by means of an intermediate layer of 98% by weight of gold and 2% by weight of silicon. The intermediate layer directly contacts and is bonded to a bare, uncoated surface of the sapphire chip and a surface of the substrate.

REFERENCES:
patent: 3680196 (1972-08-01), Leinkram
patent: 3918144 (1975-11-01), Mimata et al.
patent: 4018374 (1977-04-01), Lee et al.
patent: 4078711 (1978-03-01), Bell et al.
patent: 4181249 (1980-01-01), Peterson et al.

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