Method for mounting a flip chip on a substrate

Details Method for mounting a flip chip on a substrate Method for mounting a flip chip on a substrate

2006-12-22

2009-10-06

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C228S103000, C228S008000

Reexamination Certificate

active

07597234

ABSTRACT:
The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.

REFERENCES:
patent: 5903662 (1999-05-01), DeCarlo
patent: 6016013 (2000-01-01), Baba
patent: 6276590 (2001-08-01), Nakazato
patent: 2003/0046812 (2003-03-01), Terada et al.
patent: 1 395 106 (2004-03-01), None
patent: 7-263897 (1995-10-01), None

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