Method for mounting a driver IC chip and a FPC board/TCP/COF...

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only

Reexamination Certificate

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Details

C349S151000

Reexamination Certificate

active

07139060

ABSTRACT:
A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.

REFERENCES:
patent: 5963287 (1999-10-01), Asada et al.
patent: 6424400 (2002-07-01), Kawasaki
patent: 6556268 (2003-04-01), Lee et al.
patent: 6738123 (2004-05-01), Takahashi et al.
patent: 1235375 (1999-03-01), None
patent: 11064881 (1999-03-01), None
patent: 11-195866 (1999-07-01), None
patent: 2000183112 (2000-06-01), None
patent: 476122 (2002-02-01), None

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