Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-03-25
1998-03-17
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156196, 29832, 29842, 257783, 257784, B32B 3104, H01L 2348
Patent
active
057282471
ABSTRACT:
The present invention provides a method when using chips for tape automated bonding, or TAB structures, whereby a demand of having particular cutting and bending tools for each type of TAB structure as well as a particular thermod will no longer be necessary for the mounting of the TAB structures in a final circuit configuration. The terminal leads of a TAB structure are cut along the four sides by means of a particular cutting tool. Furthermore either the chip is glued to the substrate and/or the remaining portions of the cut terminal leads of the TAB structure are glued to the substrate, whereby if desirable intermediate shielding or dielectric layers simply may be arranged, whereupon all terminals are wire-bonded to the substrate according to prior art. TAB structures hereby may conveniently be used also for low levels of production without a raised investment cost for particular different tools for the respective chips.
REFERENCES:
patent: 3666588 (1972-05-01), Wanesky
patent: 4620215 (1986-10-01), Lee
patent: 4903118 (1990-02-01), Iwade
patent: 4967260 (1990-10-01), Butt
patent: 4967261 (1990-10-01), Niki et al.
patent: 4985749 (1991-01-01), Berneur et al.
patent: 5002818 (1991-03-01), Licari et al.
patent: 5036380 (1991-07-01), Chase
patent: 5061988 (1991-10-01), Rector
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5146662 (1992-09-01), Fierkens
patent: 5152054 (1992-10-01), Kasahara
patent: 5153708 (1992-10-01), Ohikata et al.
patent: 5210936 (1993-05-01), Simmons et al.
Bustrich Gunther
Lundstrom Lars Erik Pontus
Mayes Curtis
Telefonaktiebolaget LM Ericsson
LandOfFree
Method for mounting a circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for mounting a circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting a circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-954494