Method for monitoring the dimensions and other aspects linewidth

Image analysis – Histogram processing – For setting a threshold

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358106, 356237, 382 55, G06K 900

Patent

active

051724200

ABSTRACT:
Inspection of a metallized pattern (14) on a substrate (12) to monitor both the lateral dimensions and the intensity variation beyond tolerance limits is carried out by first capturing the image of the pattern with a television camera (20). The captured image is then compared to each of two models (40 and 42) comprising comparison patterns whose features have their lateral dimensions eroded and dilated, respectively, and the other aspect dilated and eroded, respectively, by a factor corresponding to the dimensional and intensity tolerances. The results of such comparison are logically combined to yield an image containing only defects (if any).

REFERENCES:
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patent: 4928313 (1990-05-01), Leonard et al.
patent: 4975972 (1990-12-01), Bose et al.
patent: 5046113 (1991-09-01), Hoki
A. J. Blodgett, "Microelectronic Packaging," Scientific American, vol. 247, pp. 86-96, Jul. 1983.
G. Dishon and O. Hecht, "Application of Automatic Optical Inspection (AOI) in the Manufacturing Technology of Thin Film Multichip Module (MCM)," Proc. NEPCON West, 12 pages, 1990.

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