Method for monitoring matched machine overlay

Details Method for monitoring matched machine overlay Method for monitoring matched machine overlay

2005-10-18

2005-10-18

Whitmore, S. A. (Department: 2825)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S124000, C355S027000, C355S053000, C382S144000, C716S030000

Reexamination Certificate

active

06957119

ABSTRACT:
A method for monitoring overlay alignment on a wafer that includes identifying a target machine, identifying a target process, identifying a plurality of critical layers, obtaining a plurality of overlay data from at least one of designated registration patterns on the wafer as baseline data, providing a plurality of reference overlay data, correlating the plurality of the reference overlay data with the baseline data to obtain overlay error, comparing the overlay error with specifications of the target machine, accepting the baseline data when the overlay error is within the specifications, and performing overlay alignment monitoring with the baseline data.

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Bornebroek F., et al., Overlay Performance in Advanced Processes, pp. 1-8.

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