Method for monitoring film thickness, a system for...

Details Method for monitoring film thickness, a system for... Method for monitoring film thickness, a system for...

2008-03-25

2008-03-25

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

Reexamination Certificate

active

07348192

ABSTRACT:
A method monitors a thickness of a subject film deposited on an underlying structure, the underlying structure contains at least one thin film formed on a substrate. The method includes determining thickness data of the underlying structure and storing the thickness data of the underlying structure in a thickness memory; measuring profile of optical spectrum of the subject film on the underlying structure; reading the thickness data of the underlying from the thickness memory; calculating theoretical profiles of the optimal spectrum of the subject film based upon corresponding candidate film thicknesses of the subject film and the thickness data of the underlying structure; and searching a theoretical profile of the subject film, which is closest to the measured profile of optical spectrum of the subject film so as to determine a thickness of the subject film.

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patent: 2001-317931 (2001-11-01), None

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