Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined
Patent
1985-01-02
1986-06-03
Page, Thurman K.
Coating processes
Measuring, testing, or indicating
Thickness or uniformity of thickness determined
427 10, 427240, 427241, B05D 312
Patent
active
045929211
ABSTRACT:
A method for monitoring and regulating composition and layer thickness of metallically conductive alloy layers during their manufacture by means of electrical resistance measurement. Individual alloy components are cyclically applied in coats in chronological succession. By comparison of measured actual values of the layer resistance R.sub.G after the application of each and every individual coating to rated values determined before the layer manufacture, the coating rates of the corresponding alloy component sources are controlled. The method serves for the reproducible manufacture of thin metal layers in semiconductor technology and allows the control of composition and layer thickness even during manufacture of said layers.
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patent: 4276324 (1981-06-01), Pohler et al.
patent: 4331702 (1982-05-01), Hieber et al.
IBM Technical Disclosure Bulletin, vol. 9, No. 3, pp. 247-248 (Aug. 1966).
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"Resistance Measurements by Radio Telemetric System During Film Deposition by Sputtering", by Mayer, Siemens Forsch.-u. Entwickl.-Ber. Bd. 11 (1982), No. 6, Springer-Verlag 1982, pp. 322-326.
"Radio-Frequency Sputter Deposition of Alloy Films", by K. Hieber, Siemens Forsch.-u.Entwickl.-Ber. Bd. 11 (1982), No. 3, Springer-Verlag 1982, pp. 145-148.
"An Overview of Thickness Measurement Techniques for Metallic Thin Films", by Sheldon C. P. Lim et al., Solid State Technology, Feb. 1983, pp. 99-103.
Hieber Konrad
Mayer Norbert
Page Thurman K.
Siemens Aktiengesellschaft
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