Method for monitoring and controlling force applied on...

Details Method for monitoring and controlling force applied on... Method for monitoring and controlling force applied on...

2005-11-22

2005-11-22

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S692000, C438S633000

Reexamination Certificate

active

06967166

ABSTRACT:
In one aspect, the present invention monitors a signal corresponding to a torque value of a motor that is used to maintain relative motion between a conductive top surface of a workpiece and a workpiece surface influencing device in the presence of physical contact between the conductive top surface of the workpiece and the workpiece surface influencing device. In another aspect, the present invention uses the signal to control a force applied to a top conductive surface of a workpiece during electrotreatment.

REFERENCES:
patent: 5876266 (1999-03-01), Miller et al.
patent: 2001/0024881 (2001-09-01), Hofmann et al.
patent: 2002/0052052 (2002-05-01), Robinson et al.
patent: 2002/0069967 (2002-06-01), Wright
patent: 2003/0124855 (2003-07-01), Feller et al.

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