Method for molding using venting pin

Details Method for molding using venting pin Method for molding using venting pin

1993-12-02

1997-09-09

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

With step of cleaning, polishing, or preconditioning...

26427217, 425546, 425577, 425812, B29C 3310, B29C 4502

Patent

active

056652810

ABSTRACT:
A molding method is used to mold a semiconductor device within a molded carrier ring. A mold tool (30) has an upper platen (32) and a lower platen (34). Each platen has a package cavity (36) and a carrier ring cavity (38). Between the package and ring cavities is a venting hole (60) having a venting pin (63) slidably fit therein. The venting pin includes a flat surface (64) that allows air which is forced from the package cavity during molding to escape through a narrow gap. The gap size is made small enough to prevent the passage of resin to flow through. Thus, the invention permits the mold tool to be compression cleaned and prevents mold tool down-time previously experienced when molding resin gets dogged in traditional venting holes. In another embodiment, the venting pin can be placed within the package cavity and also serve as an ejector pin.

REFERENCES:
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4990077 (1991-02-01), Morita
patent: 5059558 (1991-10-01), Tatsanakit
patent: 5175007 (1992-12-01), Elliott
Letter from T. Hara of Dai-Ichi Seiko Co. Ltd. to Mr. Ming Koh, dated Apr. 22, 1993, re: "YR Fax Dated Apr. 19", pp. 001-002.

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