Method for molding semiconductor packages

Details Method for molding semiconductor packages Method for molding semiconductor packages

1996-11-06

1998-04-28

Ortiz, Angela Y.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, B29C 4514, B29C 4502

Patent

active

057440832

ABSTRACT:
The invention is to a transfer mold design utilized with conventional transfer encapsulation. The design utilizes a varying runner cross section with an intermediate varying depth well or reservoir from which a constant gate depth and gate entry angled to the mold cavities is employed. The method and apparatus of the invention is applicable to single and multi-plunger molding utilizing thermoset and thermoplastic encapsulants for semiconductors.

REFERENCES:
patent: 4126292 (1978-11-01), Saeki et al.
patent: 5071334 (1991-12-01), Obara
patent: 5123826 (1992-06-01), Baird
patent: 5139728 (1992-08-01), Baird

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