Method for molding a small form factor digital memory card

Details Method for molding a small form factor digital memory card Method for molding a small form factor digital memory card

2008-05-27

2008-05-27

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C438S106000, C438S112000, C438S124000, C257S787000, C257S679000, C257S667000, C257SE23116, C257SE23125, C257SE23128

Reexamination Certificate

active

07378301

ABSTRACT:
A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash IC and a (e.g., land grad array) controller package for enclosing a controller IC are mounted on a printed wiring board within a mold cavity. A high melt flow index resin is injected into the mold cavity to form an integral, solid body within which to completely encapsulate the flash IC and controller packages and form a cover over top the flash IC package so as to maintain the required memory card height tolerance. In one embodiment, the resin material is injected downwardly into the mold cavity from locations above the respective rows of leads of the flash IC package. In another embodiment, the resin material is injected laterally into the mold body from locations at opposite sides thereof adjacent the respective rows of leads of the flash IC package.

REFERENCES:
patent: 5173840 (1992-12-01), Kodai et al.
patent: 6462273 (2002-10-01), Corisis et al.
patent: 7089661 (2006-08-01), Fong et al.
patent: 7174628 (2007-02-01), Wang et al.

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