Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-11-25
1999-04-06
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
2940207, 2940208, 29837, 29840, 29841, 29843, 29847, 29850, 174263, 174267, 2281801, 228264, 361774, 439 83, H05K 334, H05K 340
Patent
active
058902848
ABSTRACT:
In aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the circuit board to sever the connection between the via and the circuit, attaching the pad connector to the circuit board, and connecting the pad connector to the circuit of the circuit board.
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IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978 "Engineering Change Technique Using Off-Set Holes for Printed-Circuit Boards".
IBM Technical Disclosure Bulletin, vol. 22, No. 1, Jun. 1979, "Defective Hole Repair".
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IBM Technical Disclosure Bulletin, vol. 33, No. 1B, Jun. 1990, "Printed Circuit Net Repair Utilizing a Coaxial Cable-to-Board Pin Connection".
Chartrand Richard L.
Ma Wai-Mon
Stinemire Roger A.
Ahsan Aziz M.
International Business Machines - Corporation
Peterson Peter W.
Vo Peter
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