Patent
1996-05-20
1999-07-27
Teska, Kevin J.
G06F 1700, G06F 1750
Patent
active
059304995
ABSTRACT:
The invention resides in a computer-aided design system for defining physical placement and floor-planning of electronic circuits on a given substrate. Improve utilization of substrate area is achieved by arranging circuits into structural (e.g., data-path) and non-structural (e.g., non-data-path) zones for effectively segregated chip or board lay-out. Software is provided to receive a netlist file and determine therefrom which components are categorizable within structural portion. Furthermore, software is provided to produce a lay-out file which defines physical placement of the prototype design, wherein structural components are inter-placed with related control components, for example, to provide sliced-structure placement of a semiconductor chip.
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Chen Hau-Yung
Chen Yulin
Chia Wei-Kong
Ku Tsu-Wei
Lo Rwei-Cheng
Arcadia Design Systems, Inc.
Siek Vuthe
Teska Kevin J.
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