Method for minimizing warp in the production of electronic assem

Details Method for minimizing warp in the production of electronic assem Method for minimizing warp in the production of electronic assem

1996-11-08

1999-03-30

Krynski, William

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428213, 428209, 174256, B32B 300

Patent

active

058886311

ABSTRACT:
The present invention relates to assembly techniques and the resulting products which are thermally stable, have high structural integrity, and compensate for thermal stresses that occur between the various components of the package. This is accomplished, in-part, by designing the package so that the coefficient of thermal expansion (CTE) of a stiffening ring which is mounted on the package substrate matches the CTE of the substrate and optional lid. Further, the particular adhesives used to bond the stiffening ring are chosen to match their CTE to that of the substrate, ring and lid. Moreover, the substrate is designed so that its CTE, at least in-part, matches that of the chip, and also that of the stiffening ring.

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