Semiconductor device manufacturing: process – Having diamond semiconductor component
Patent
1998-05-29
1999-03-30
Niebling, John F.
Semiconductor device manufacturing: process
Having diamond semiconductor component
438142, 438150, H01L 2100, H01L 21335, H01L 2184
Patent
active
058888462
ABSTRACT:
A method for microfabricating diamond includes the steps of: forming a resist layer composed of a ladder silicone spin-on glass material on the surface of diamond; performing lithography, in which the resist layer is irradiated with an electron beam or an ion beam in a given pattern; developing the resist layer to form the given pattern; and etching diamond by an ECR plasma etching method or a high-frequency plasma etching method.
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Kobashi Koji
Miyata Koichi
Nozawa Toshihisa
Suzuki Kohei
Kabushiki Kaisha Kobe Seiko Sho
Lattin Christopher
Niebling John F.
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