Method for microfabricating diamond

Semiconductor device manufacturing: process – Having diamond semiconductor component

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438142, 438150, H01L 2100, H01L 21335, H01L 2184

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active

058888462

ABSTRACT:
A method for microfabricating diamond includes the steps of: forming a resist layer composed of a ladder silicone spin-on glass material on the surface of diamond; performing lithography, in which the resist layer is irradiated with an electron beam or an ion beam in a given pattern; developing the resist layer to form the given pattern; and etching diamond by an ECR plasma etching method or a high-frequency plasma etching method.

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patent: 5783303 (1998-07-01), Tsuei

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