Method for micro-pack production

Details Method for micro-pack production Method for micro-pack production

1984-08-31

1987-05-26

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 2281802, H05K 334

Patent

active

046674020

ABSTRACT:
A wafer is adhered to a foil with an adhesive which is resistant, for a short time, to soldering temperature and the wafer is then divided into chips. After the soldering of the chip to a carrier strip, a pin or spindle beneath the chip penetrates the foil and removes the chip from the foil. The invention has the particular advantage that few method steps are necessary and that the soldering temperature may be synchronized exactly with the soldering operation.

REFERENCES:
patent: 3698076 (1972-10-01), Kingsley
patent: 3722072 (1973-03-01), Beyerlein
patent: 3724068 (1973-04-01), Galli
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3871936 (1975-03-01), Boyer et al.
patent: 3887996 (1975-06-01), Hartleroad et al.
patent: 4079509 (1978-03-01), Jackson et al.
patent: 4247590 (1981-01-01), Hayakawa et al.
patent: 4526646 (1985-07-01), Suzuki et al.

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