Method for metallizing through holes in thin film substrates, an

Details Method for metallizing through holes in thin film substrates, an Method for metallizing through holes in thin film substrates, an

1993-11-16

1996-06-11

Bell, Janyce

Coating processes

With stretching or tensioning

20419214, 427 97, 427 99, 427172, 427250, 427322, 4273982, 427404, 427409, B05D 512, B05D 312

Patent

active

055253695

ABSTRACT:
A method for vapor phase depositing a thin seed layer of, for example, chromium and copper onto the side walls of through holes in thin film substrates of, for example, polyimide is disclosed. This method is useful in fabricating devices such as a thin film semiconductor chip carrier in which a semiconductor chip mounted on one major surface of the chip carrier is electrically connected to a ground plane and/or a power conductor on the other major surface of the chip carrier via one or more metallized through holes.

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