Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate
Patent
1996-04-12
1997-10-07
Gorgos, Kathryn L.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly nonmetal substrate
205161, 205162, 205163, 205164, 205165, 205166, 205167, 205182, 205186, 205187, C25D 554, C25D 556, C23C 2802
Patent
active
056743734
DESCRIPTION:
BRIEF SUMMARY
This is a national stage application of PCT/FR94100860 filed Jul. 11, 1994
FIELD OF THE INVENTION
The invention relates to a process for metallizing nonconductive substrates.
PRIOR ART
Numerous processes are already known for forming a metallic layer on a nonconductive substrate or support, whether this pertains to glass, plastic materials, composite materials with a nonconductive matrix, paper, ceramic materials, etc.
A first family of processes calls for the deposition by evaporation under vacuum of liquid metal thanks to various means of heating (Joule effect, electron bombardment, cathode sputtering, etc.). Thus, it is possible to deposit a layer of aluminum on films typically made of plastic material (PET, for example).
As variants of these processes, one finds the processes of deposition chemically known under the term "CVD" (chemical vapor deposition), possibly with the help of a plasma (PEVD processes=Plasma Enhanced Vapor Deposition).
The processes of chemical or electrochemical deposition of metals are also known.
These processes are considered conventional in the case of conductive supports.
In the case of nonconductive supports, a preliminary treatment is necessary before proceeding with the actual chemical or electrochemical deposition.
This treatment can be metallization under vacuum, as described in the patent FR-A1-2 558 485 relating to the manufacturing of a porous metallic structure.
This treatment can also be an activation treatment based on precious metals (silver, palladium, gold), as described in the work "Electroplating of Plastics--J. Christof et al.--Finishing Publications Ltd. 1977 UK," or else in the work "Surface Finishing Systems: Metal and Nonmetal Finishing Handbook-Guide--by George J. Rudzki--Finishing Publications Ltd. 1983--England."
The typical process includes the sequence of the following steps: copper, nickel, or tin (relatively slow deposition); rapid deposition than the chemical deposition--necessary step for obtaining a conductive surface). Finally, there are processes in which the preliminary treatment, necessary for the implementation of conventional chemical or electrochemical depositions (respectively, reduction of a metallic salt chemically, using a reducing agent, or electrochemically), consists of incorporating in the substrate conductive fillers such as conductive flakes or powders (metallic powders, fibers of carbon, graphite, etc.), or fillers made conductive by reduction.
Thus, French application FR-A-2 544 340 describes a process for manufacturing a conductive film which includes the following steps: Cu.sub.2 O in powder form; surface (bring to light) particles of Cu.sub.2 O;
Likewise, in the French application FR-A-2 518 126, a process is described for metallizing a molded object by electrolytic deposition, which includes the following steps (Example 1). the prepolymer material; removal, and treatment in an ultrasound tank, in order to expose the particles of Cu.sub.2 O;
There are also known processes which allow one to carry out an electroless metallic deposition without the need for an activation treatment using a precious metal.
Thus, U.S. Pat. Nos. 3,146,125 and 3,226,256 disclose processes which typically include the following steps: ink on an insulating support; particles;
Finally, there are known processes, as described in U.S. Pat. No. 4,327,125, in which one deposits on the nonconductive surface to be copper-plated a colloid of Cu particles, formed from a copper salt and a reducing agent; then, one performs a chemical deposition of copper in an electroless bath.
The purpose of the invention is a treatment of any nonconductive surface, of any shape, allowing one then to carry out a metallization, not only by electroless deposition, but above all by electrolytic deposition, which is advantageous from an economic standpoint, given the high rate of deposition of the electrolytic method.
DESCRIPTION OF THE INVENTION
The invention can be implemented according to two practical modes.
According to a first mode of the invention, the process for
REFERENCES:
patent: 2893930 (1959-07-01), Sheheen
patent: 5389270 (1995-02-01), Thorn et al.
De Hollain Guy
Insenga Serge
N'Guyen Van Huu
Negrerie Marcel
Gorgos Kathryn L.
Trefimetaux
Wong Edna
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