Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
1999-01-07
2001-03-06
Gulakowski, Randy (Department: 1746)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S014000, C216S016000, C216S020000, C216S036000
Reexamination Certificate
active
06197208
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid which are arranged on a carrier.
BACKGROUND INFORMATION
The many different methods are known for producing printed circuits from at least one printed circuit board and a hybrid.
For example, in the case of hybrids arranged on printed circuit boards, electrical connections between the printed circuit board and the hybrid are produced by solder edges, it being necessary in this case for soldering points to be present both on the printed circuit board and on the hybrid. Arranging these soldering points is time-consuming and not always reliable, since deficiencies can occur in the contacting.
German Patent No. 40 28 440 A1 describes a method for producing printed circuits from at least one printed circuit board and a hybrid, in which at least one unsintered ceramic foil is printed with printed circuit traces, thereupon deformed, subsequently fixed in this form by sintering, and joined to the printed circuit board and/or another hybrid. It may be that the solder edges can be omitted in such a contacting of the printed circuit board and the hybrid. However, it is nevertheless necessary to form electrically conductive connections, e.g., by solder or a conductive adhesive, between the printed circuit board and the hybrid arranged on it. This must be done simultaneously with the mounting of the hybrid on the printed circuit board, and likewise involves the danger that contacting deficiencies can occur.
SUMMARY OF THE INVENTION
Therefore, an object of the present invention is to further develop a method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid, such that a reliable and simultaneous contacting of the printed circuit board or of the punched grid and of the hybrid is possible in the easiest possible technical manner.
This objective is achieved according to the present invention in a method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid, which includes the following steps:
forming contact elements in a contacting foil;
positioning the contacting foil over the hybrid in such a way that the contact elements are arranged at preselected positions between printed circuit traces of the hybrid and printed circuit traces of the printed circuit board;
etching away at least a portion of the contacting foil, such that the contact elements are at least partially freely accessible.
The use of a contacting foil upon which contact elements are formed, and which is positioned over the hybrid so that the contact elements are arranged at preselected positions, and the subsequent etching away of at least a portion of this contacting foil in such a way that the contact elements are at least partially freely accessible, has the particularly great advantage that a simultaneous contacting of the printed circuit board or of the punched grid and the hybrid can be implemented in a manner which is technically unproblematical, and therefore cost-effective as well.
The contacting foil could be completely etched away, so that only the contact elements remain after the etching process. However, a particularly advantageous specific embodiment provides that the contacting foil is completely etched away in the area of the hybrid, and is partially etched away in the area of the contact elements, such that a frame remains, to which the contact elements are attached. The contact elements are stabilized by this frame at preselected positions which are optimal for the contacting.
One advantageous specific embodiment provides for the at least one portion of the contacting foil that is to be etched away, to be etched away by plasma etching.
The most diversified specific embodiments are likewise conceivable as far as the formation or structuring of the contact elements in the contacting foil is concerned.
In one advantageous specific embodiment, the contact elements in the contacting foil are formed by etching. In this way, the contact elements can be formed similarly to the generally known production of printed circuit traces on a printed circuit board in a particularly simple manner.
To permit a further contacting of the hybrid and of the printed circuit board or the punched grid, provision is advantageously made for a tin deposit to be applied on the contact elements, with whose aid further contact elements can be contacted, e.g., by spot soldering or hot-air soldering.
REFERENCES:
patent: 4631820 (1986-12-01), Harada et al.
patent: 6122704 (2000-09-01), Hass et al.
patent: 40 28 440 (1992-03-01), None
patent: 44 22 996 (1996-01-01), None
patent: 2 630 615 (1989-10-01), None
patent: 2 124 433 (1984-02-01), None
patent: 4-133388 (1992-05-01), None
Gulakowski Randy
Kenyon & Kenyon
Olsen Allan
Robert & Bosch GmbH
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