Method for metallizing aluminum pads of an integrated circuit ch

Details Method for metallizing aluminum pads of an integrated circuit ch Method for metallizing aluminum pads of an integrated circuit ch

1979-09-07

1983-02-08

Kendall, Ralph S.

Coating processes

With pretreatment of the base

Metal base

427 90, 427436, 106 129, C23C 300

Patent

active

043729967

ABSTRACT:
A method including a novel bath is described for the nickeling of the aluminum pads of a chip, when either in die form or in wafer assembly. A near-neutral pH immersion zinc bath is used to cover the aluminum with zinc, which is followed by immersion in an electroless boron-nickel solution for nickeling of the zinc. The method eliminates the need to isolate the chip silicon from the plating bath.

REFERENCES:
patent: 2906647 (1959-09-01), Roschen
patent: 3616835 (1965-11-01), Saubestre
patent: 3620834 (1971-11-01), Duffy
patent: 3669854 (1972-06-01), Harbulak

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