Method for metallizing a semiconductor element

Details Method for metallizing a semiconductor element Method for metallizing a semiconductor element

1979-11-30

1981-01-27

Powell, William A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156643, 156645, 156646, 156657, 204192E, 427309, B05D 512, H01L 21306

Patent

active

042475791

ABSTRACT:
A method for forming an electrode on a semiconductor device is described. Where surface adjacent regions of differing dislocation densities are present, an initial mechanical abrading step followed by a plasma etching step produces a surface to which a metal layer may be applied with relatively uniform adherence characteristics.

REFERENCES:
patent: 2615966 (1952-10-01), Lark-Horovitz et al.
patent: 3075892 (1963-01-01), John et al.
patent: 3615956 (1971-10-01), Irving et al.
patent: 3795557 (1974-03-01), Jacob
patent: 4056642 (1977-11-01), Saxena

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